The August 1997 issue of Technometrics has an interesting article about testing for spatial clustering: Hansen, Mark H, Nair, Vijayan N. and Friedman, David J. 1997. Monitoring wafer map data from integrated circuit fabrication processess for spatially clustered defects. Technometrics 39:241-253. This paper might apply to spatial analyses of forest conditions, especially with remotely sensed satellite data for binary responses.
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